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Electrical contact to molecules in semiconductor structures established for the first time

Tiny pores were filled with molecules and brought into electrical contact via a platinum electrode from below and a gold nanoparticle electrode from above. Section of a silicon wafer containing thousands of pores with contact pads for electrical characterization. (Image: IBM Research – Zurich)
Tiny pores were filled with molecules and brought into electrical contact via a platinum electrode from below and a gold nanoparticle electrode from above. Section of a silicon wafer containing thousands of pores with contact pads for electrical characterization. (Image: IBM Research – Zurich)

Electrical circuits are constantly being scaled down and extended with specific functions. A new method now allows electrical contact to be established with simple molecules on a conventional silicon chip. The technique promises to bring advances in sensor technology and medicine, as reported in the journal Nature by chemists from the Ðǿմ«Ã½ and researchers from IBM Research – Zurich in Rüschlikon.

12 July 2018

Tiny pores were filled with molecules and brought into electrical contact via a platinum electrode from below and a gold nanoparticle electrode from above. Section of a silicon wafer containing thousands of pores with contact pads for electrical characterization. (Image: IBM Research – Zurich)
Tiny pores were filled with molecules and brought into electrical contact via a platinum electrode from below and a gold nanoparticle electrode from above. Section of a silicon wafer containing thousands of pores with contact pads for electrical characterization. (Image: IBM Research – Zurich)

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